India has launched the application portal for the second phase of its semiconductor programme, opening the door to new chip factories, equipment makers and packaging plants. Union Electronics and Information Technology Minister Ashwini Vaishnaw launched the Semicon 2.0 web application portal in New Delhi on Friday, 6 November.

Three pillars open now

Applications are live for three of the programme's six strategic pillars: Pillar 2, covering semiconductor machines and materials; Pillar 3, for setting up additional fabrication plants; and Pillar 4, for strengthening the assembly, testing, marking and packaging ecosystem. The remaining pillars cover chip design, research and development, and talent development. The Union Cabinet approved Semicon 2.0 with a fiscal outlay of ₹1,27,500 crore under the India Semiconductor Mission.

Only complete applications accepted

Mr Vaishnaw said the portal had been deliberately designed so that incomplete applications cannot be submitted, arguing that the government wants only companies with serious technological capabilities and long-term commitment. "The frivolous application makers, please stay out. We do not want you," he said at the launch. He added that companies applying only to claim scheme benefits would be rejected.

Twelve component projects cleared

At the same event, the government approved 12 more applications under the Electronics Components Manufacturing Scheme, with projected investment of ₹7,503 crore. The projects are spread across seven states — Gujarat, Karnataka, Madhya Pradesh, Maharashtra, Punjab, Tamil Nadu and Uttar Pradesh — and are projected to generate production worth ₹39,045 crore and create 7,127 direct jobs. Approved companies include NeST ICELR, TDConnex, Modern Automotives and Voltix Semicon. Half of the units approved under the scheme so far are small and medium enterprises, the minister said.